The Taiwanese chipset maker, MediaTek announces two new top-end processors in its long Dimensity series run – MediaTek Dimensity 1200 and Dimensity 1100 SoCs as the first of its kind with TSMC’s 6nm process technology.
MediaTek’s Dimensity 1200 and Dimensity 1100 chipsets come with support for 5G standalone and non-standalone architectures with True Dual SIM 5G (5G SA + 5G SA).
Both processors use the 1000-series GPU, the Mali-G77 MC9 GPU with 9 cores. Where it offers a 13% increase in performance compared to the previous generation and six-core MediaTek APU 3.0. The premium Dimensity 1200 is MediaTek’s first SoC that uses a 1+3+4 CPU configuration.
The ultra-core Arm Cortex-A78 core is clocked at an impressive 3.0GHz for enhanced performance, while the three Arm Cortex-A78 super cores clocked up to 2.6GHz and four Arm Cortex-A55 efficiency cores clocked at 2GHz.
When it comes to comparison, the Dimensity 1200’s A78-core is 20% faster than the Dimensity 1000+ with A77 core at 2.6GHz. However, the overall CPU performance is up by 22% and power efficiency is up 25% compared to previous generations.
On the other hand, the Dimensity 1100 comes with support for an octa-core CPU, four Arm Cortex-A78 cores at up to 2.6GHz, and four Arm Cortex-A55 efficiency cores clocked at 2GHz. It also uses the six-core MediaTek APU 3.0.
MediaTek ensured that both chipsets support AI camera features including a 20% faster processing Night Shot, AI-Panorama Night Shot, AI Multi-Person Bokeh, AI noise reduction (AINR), and HDR capabilities. The chipsets also support new AI-enhanced video playback features including AI SDR-to-HDR.
Although, the MediaTek Dimensity 1200’s 5-core ISP supports 200MP photos, 4K HDR video capture (that is 40% dynamic range increased), while the Dimensity 1100 has 108MP camera support. The AV1 video now has hardware acceleration.
MediaTek 1200 SoC comes with ultra-fast 168Hz refresh rates and the new Dimensity 1100 supports 144Hz refresh rates. There is support for Bluetooth 5.2, ultra-low latency true wireless stereo audio, and LC3 encoding for higher quality, lower latency streaming audio.
Fortunately for the Dimensity 1200, it has received TÜV Rheinland certification for its 5G performance, with tests covering 72 real-world scenarios. Both feature MediaTek’s HyperEngine 3.0 gaming technologies, which includes 5G call and data concurrency for more reliable connectivity, plus multi-touch boost touchscreen responsiveness.
The new chipsets also support ray tracing in mobile games and artificial reality applications for more realistic visuals, along with super hotspot power savings which let users go longer in between charges.
As usual, the MediaTek Dimensity 1200 and Dimensity 1100 SoC will start entering the Smartphone around the end of March, beginning of April, from several Smartphone companies such as Xiaomi, Vivo, and Oppo. As Realme takes the first position to release its Dimensity 1200 powered flagship device.
This post was written by FBL Admin and was first posted to Free Browsing Link
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